Huangshan Scholar Professor


Wen Huang received his Ph.D. degree in electrical and computer engineering from the University of Illinoisat Urbana-Champaign. He is an active researcher in area of the advanced nano-scale RF/microwave/power devices and circuits. His expertise includes exploring origami membrane nanotechnology and 2-D material enabled novel design and fabrication for RF/microwave/Power IC miniaturization, and exploring the design and fabrication of soft/stretchable RF/microwave/power electronics for wearable applications. He is also familiar with traditional RFIC/MMIC design and measurement, and circuit-level semiconductor device modeling.


Sep 2018 – Present Professor
Hefei University of Technology

May 2017 – Aug 2018 Postdoctoral Research Associate
University of Illinois at Urbana-Champaign

Jan 2013 – May 2017 Research Assistant
University of Illinois at Urbana-Champaign

Aug 2010 – Jan 2013 Visiting Research Scholar
Beckman Institute & Micro and Nanotechnology Lab

Sep 2007 – Aug 2010 Research Assistant
University of Electronic Science and Technology of China


2013 – 2015 University of Illinois at Urbana-Champaign
Doctor of Philosophy (Ph.D.) Electrical and Electronics Engineering

2007 – 2010 University of Electronic Science and Technology of China
Electronics Engineering

2001 – 2005 University of Electronic Science and Technology of China
Bachelor's of Engineer Electronics Engineering

Selected publications

1. Wen Huang; Zhendong Yang; Mark D. Kraman; Qingyi Wang; Zihao Ou; Miguel Munoz Rojo; … & Xiuling Li (2020). Monolithic mTesla Level Magnetic Induction by Self-Rolled-up Membrane Technology, Science Advances, 2020, 6.

2. Huang, W., Zhou, J., Froeter, P., Walsh K., Liu, S., … & Li, X. (2018). MonolithicRF/Microwave Air Core Microtube Transformers with Extreme Performance Scalability. Nature Electronics, 1(5), 305.(Website Cover)

3. Huang, W., & Li, X. (2018). Downscaling inductors with graphene. Nature Electronics, 1(1),6. (invited review).

4. Xu, S., Yan, Z., Jang, K. I., Huang, W., Fu, H., Kim, J., ... & Rogers, J. A. (2015). Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling. Science,347(6218), 154-159. (Cover Paper)

5. Fu, H., Nan, K., Bai, W., Huang, W., Bai, K., Lu, L., ... & Han, M. (2018). Morphable 3Dmesostructures and microelectronic devices by multistable buckling mechanics. Nature Materials,1. (Cover Paper)

6. Bai K, Cheng X, Xue Z, Song H, Sang L, Liu F, …, Huang W, Huang Y, Zhang YH (2020). Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy. Science Advances, accepted.

7. Pang, Wenbo; Cheng, Xu; Zhao, Haojie; Guo, Xiaogang; Ji, Ziyao; … Huang, Wen; Li, Tiefeng; Zhang, Yihui (2019). Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms. National Science Review, 2019, 7(2): 342-354.

8. Huang, W., Koric, S., Yu, X., Hsia, K. J., & Li, X. (2014). Precision structural engineering of self-rolled-up 3D nanomembranes guided by transient quasi-static FEM modeling. Nano Letters, 14(11),6293-6297.

9. Huang, W., Yu, X., Froeter, P., Xu, R., Ferreira, P., & Li, X. (2012). On-Chip Inductors with Self-Rolled-Up SiNx Nanomembrane Tubes: A Novel Design Platform for Extreme Miniaturization. Nano Letters, 12(12), 6283-6288.

10. Sang, Lei; Wu, Shaoran; Liu, Gang; Wang, Jinhong; Huang, Wen (2020). High-Gain UWB Vivaldi Antenna Loaded with Reconfigurable 3-D Phase Adjusting Unit Lens. IEEE Antennas and Wireless Propagation Letters, 2020, 19(2): 322-326.